Advantech AIW-173 Multiprotocol Modules
Advantech AIW-173 Multiprotocol Modules offer a range of industrial‑grade wireless modules that support Wi‑Fi 7 and BLUETOOTH® 5.3 technologies. These modules support 6GHz frequency, Multi‑Link Operation (MLO), and dual‑band concurrent connectivity for high‑performance networking. The AIW-173 wireless modules include robust security features with support for 64/128bit WEP, WPA, WPA2, WPA3, and 802.1x encryption standards. These modules are compatible with major platforms such as Rockchip, Nvidia, NXP, Qualcomm, Intel, and AMD, ensuring flexibility across embedded systems. The AIW-173 modules support multiple form factors, including M.2, LGA, and full‑size Mini‑PCIe, to fit diverse device integrations. These wireless modules are designed to operate in harsh industrial environments with a wide temperature range of -40°C to 85°C.
Features
- Support 6GHz frequency
- Support IEEE 802.11 be/ax/ac/b/g/n + Bluetooth 5.3 technologies
- Support Multi-Link Operation (MLO)
- WCN7851 main chipset
- 3V to 3.3V operating voltage range
- 2Tx/2Rx (2 IPEX MHF4 connector receptacle)
- 64/128-bit WEP, WPA, WPA2, WPA3, 802.1x security
- Windows 11/Linux OS supported
- -40°C to 85°C operating temperature range
- Compatible with Rockchip, Nvidia, and NXP platforms
- Dual Band Dual Concurrent (DBDC) support
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