
Bergquist Company TGP 6000ULM 6W/m-K, High Performance GAP PAD®
Bergquist Company TGP 6000ULM 6W/m-K, High-Performance GAP PAD® are soft gap-filling materials for high-performance applications requiring low assembly stress. These materials offer exceptional thermal performance at low pressures due to the unique filler package and ultra-low modulus resin formulation. The 6000ULM series is highly conformal, even to surfaces with high roughness and/or topography, and allows for excellent interfacing and wet-out characteristics. This Bergquist Company TGP 6000ULM series features 6W/m·k thermal conductivity and operates in a -60°C to 200°C temperature range. These materials come with UL 94V-0 flammability rating.Features
- Outstanding thermal performance
- Low stress
- Ease of handling
- High-tack and low-tack sides
- High compliance
- Reworkable
- Excellent wet-out characteristics
- High dielectric strength
- Ultra-low modulus
- Silicone technology
Applications
- Telecommunications
- ASICs and DSPs
- Consumer electronics
- Thermal module to heat sink assembly
Specifications
- 6W/m∙K thermal connectivity
- 41.3kPa Young's modulus
- UL 94V-0 flammability rating
- -60°C to +200°C operating temperature range
Publicado: 2019-12-05
| Actualizado: 2023-06-09