Bergquist Company Liqui-Form TLF 6000HG 6W/m-K Liquid Formable Gel
Bergquist Company Liqui-Form TLF 6000HG 6W/m-K Liquid Formable Gel is designed to meet the performance needs of next-generation 5G base stations and remote antenna systems. The pre-cured, one-part gel has a thermal conductivity of 6.0W/m-K and can be used in gaps as large as 3mm. The gel offers high thermal conductivity, good dispensing efficiency, and high thermal reliability. This material is specially designed to provide an effective electronic component cooling capability for 5G base stations and remote antenna assemblies where a highly reliable vertical gap stability is required. Bergquist Liqui-Form TLF 6000HG Liquid Formable Gel is pre-cured, requiring no mixing or refrigeration.
Features
- 6.0W/m-K thermal conductivity:
- Dispensable pre-cured gel
- Stable viscosity in storage and in the application
- Excellent chemical and mechanical stability
- For gaps as large as 3.0mm
- Automated dispensing capable
Applications
- Telecom wireless infrastructure
- Remote radio unit (RRU)
- Active antenna unit (AAU)
- Baseband processing unit (BPU)
- Filling gaps between heat-generating devices to heat sinks
- Devices requiring low assembly pressure
- High-value assemblies with rework
Thermal Gel
Videos
Additional Resources
- Press Release - Thermal Gel from Henkel lets 5G Telecom Components go Vertical
- NASA Outgassing Approved Products
- Henkel Electronic Material Solutions for Radar, Guidance System, and Aviation Industries
- Materials for Wireless Infrastructure 5G Telecom Solutions
- Case Study: Thermal Gel Critical Cooling for 5G Infrastructure Systems
- Material Solutions for Cloud/Hyperscale Datacenter Switches, Routers and Servers
- Sell Sheet: Bergquist Liqui-Form TLF 6000HG
Related Product
Bergquist Company 5G Products
Multiple formats are provided for maximum system reliability: pads, gels, liquids and adhesives.
Publicado: 2020-06-16
| Actualizado: 2022-11-15