Analog Devices Inc. LB2223B Multi-Footprint Lab Board is a prototyping board designed to support a wide variety of package types for use during application design. The LB2223B Lab Board supports Mini Small Outline Package (MSOP), Small Outline Integrated Circuit (SOIC), Dual Flat Pack (DFN), and Small Outline Transistor (SOT) package types. Each of the pin landing pads is connected to an edge pad to simplify wiring surface-mount packages into other circuits. Additionally, a center trace with pads at each end, and center pads on the two boards on the right, are included for use as a ground trace.
Enables easy application design with pre-configured landing pads for a wide variety of package types
All pin landing pads connect to outer edge
Chip capacitors can be placed and soldered from a corner pad to a center trace ground pad